- LairdTflexTM 300Flexible thermal pads are on the market. Notebooks and desktop computer memory solid-state motherboards are universal for heat dissipation. They are non-conductive, flexible, and have strong heat absorption capabilities. They can be cut at will! - Strong heat dissipation stable and reliable Laird TflexTM 300 flexible thermal pad is specially developed for such chips as video memory particles, north-south bridges, notebook cooling modules, and memory hard drives.The brand''''''''''''''''''''''''''''''''''''''''''''''''''''''''''''''''''''''''''''''''''''''''''''''''''''''''''''''''''''''''''''''''''''''''''''''''''''''''''''''''''''''''''''''''''''''''''''''''''''''''''''''''''''''''''''''''''''''''''''''''''''''''''''''''''''''''''''''''''''''''''''''''''''''''''''''''''''''''''''''''''''''''''''''''''''''''''''''''''''''''''''''''''''''''''''''''''''''''''''''''''''''''''''''''''''''''''''''''''''''''''''''''''''''''''''''''''''''''''''''''''''''''''''''''''''''''''''''''s original factory uses a wide range of thermally conductive materials, which can effectively fill the gap between the heat dissipation module and the chip, accelerate heat conduction to reduce the temperature of the chip. U.S. brand official data The parent company of the American Laird Group is the British Laird Group Public Co., Ltd. (it is a company listed on the London Stock Exchange with a history of more than 140 years), and the American Laird Electronic Materials Group is registered in Delaware, the United States. Acquired a series of manufacturers of electromagnetic shielding products, thermal products and wireless antenna products (including such as Instrument Specialties, APM, Bavaria Elektronik, Altoflex,  ;R&F Products, BMI, Warth, Thermagon, Centurion, Melcor and other companies) to form today''''''''''''''''''''''''''''''''''''''''''''''''''''''''''''''''''''''''''''''''''''''''''''''''''''''''''''''''''''''''''''''''''''''''''''''''''''''''''''''''''''''''''''''''''''''''''''''''''''''''''''''''''''''''''''''''''''''''''''''''''''''''''''''''''''''''''''''''''''''''''''''''''''''''''''''''''''''''''''''''''''''''''''''''''''''''''''''''''''''''''''''''''''''''''''''''''''''''''''''''''''''''''''''''''''''''''''''''''''''''''''''''''''''''''''''''''''''''''''''''''''''''''''''''''''''''''''''''s scale; official data screenshot : Comes with adhesive for easy fixation TflexTM 300 has its own stickiness, which is slightly sticky but sufficientAdhering to the surface of the chip, it will not fall off and will not cause damage to the chip. The material is soft and does not damage the chip TflexTM 300 material is soft, compressible and kneaded into various shapes, and can be reused. The new flexible material can effectively prevent the chip from being damaged, and at the same time, it has the function of tightly filling the gap between the chip and the heat sink. Suitable for all kinds of notebooks Many of the thermal pads that come with the notebook are of this type. The 4 positions in the red circle in the picture below are TflexTM 300 flexible thermal pads. After disassembling, it is found that there is aging and damage.DirectlyTflexTM 300Cut and use according to the size of the chip. The yellow area is the CPU and graphics card. The original silicone grease is used. You need to replace Shin-Etsu or Dow Corning silicone grease. The thermal pad cannot be used instead. Laird 700 series graphics card thermal pad,Remind novices: This material can not be directly used for graphics card core and CPU heat dissipation. Suitable for desktop video memory nvidia gtx1080 original video memory factory standard thermal pad isTflexTM 300, Foxconn’s foundry heat dissipation module has imported this flexible thermal pad in batches, which is suitable for mostThe peripheral video memory of the graphics card can be cut into various sizes according to actual needs. The screenshot comes from Pacific Computer Network. Wide range of use TflexTM 300 flexible thermal pad can also be used for router heat dissipation, mobile phone motherboard heat dissipation, computer motherboard mos heat dissipation, tablet computer heat dissipation, projector heat dissipation, LED heat dissipation and other chips that require high insulation and require heat dissipation. instrument.Large size 80mm*40mm TflexTM 300 flexible thermal pad single size: length 80mm*width 40mm, thickness can be selected from 1.0mm, 1.5mm, 2.0mm, the following figure is a comparison with the actual size of iphone6, it can be cut according to the size of the chip when using it. , The operation is simple and convenient!Double protective film TflexTM 300 comes with a protective film from the factory to prevent contamination. When using it, remember to tear off the transparent film on the back and then the logo film on the front. Powerful merchants with a large amount of inventory This shop specializes in thermal conductivity materials for major foreign brands, and can customize imported thermal conductivity materials in various sizes for customers, and provide various technical support. Welcome all colleagues to discuss cooperation! - |